| 摘要 |
PROBLEM TO BE SOLVED: To provide a method to carry out an coating of a semiconductor laser end surface without fail and efficiently. SOLUTION: The method includes a process to arrange at least one or more semiconductors on a first plate having a flat surface to fix them as a first body 301 to be treated, a processing to locate the first body to be treated in a treatment chamber to deposit a film, a process to locate a second plate 402 having the same function as the first plate 302 on the first body to be treated opposite each other to unite them, a process (a) to turn the united first plate 302 and second plate 402 upside down, a process (b) to remove the first plate 302, a process (c) to fix the semiconductor element located on the second plate 402 as the second body 301 to be treated, and a process to locate the second body to be treated in the treatment chamber to deposit a film. COPYRIGHT: (C)2004,JPO&NCIPI
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