| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyether resin from which insulated films having low relative dielectric constants and excellent heat resistance can be produced. SOLUTION: This polyether resin is obtained by the polycondensation of a dihalogen compound with at least one of dihydroxy compounds represented by formula (I) [Ar<SP>1</SP>and Ar<SP>2</SP>are each independently a divalent group having one hydroxyl group on the aromatic ring; R<SP>1</SP>and R<SP>2</SP>are each independently a 1 to 20C trivalent organic group; X is a single bond, a 1 to 20C divalent hydrocarbon group, an ether group, a thioether group, a carbonyl group or a divalent group represented by formula (A) (P<SP>1</SP>and P<SP>2</SP>are each independently a monovalent organic group, or may be bound to each other to form a ring)]. COPYRIGHT: (C)2004,JPO&NCIPI
|
