CONDUCTIVE PASTE, CIRCUIT BOARD USING THE SAME, AND MANUFACTURING METHOD OF THE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To achieve a circuit board having high connection reliability by stably forming high quality via-hole conductors with less variations. SOLUTION: The circuit board is formed by using conductive paste featured being composed of conductive particles having an average particle diameter of 0.5-20μm, a specific surface area of 0.07-1.7 m2/g, and at least two peaks of a particle size distribution; and conductive particles formed by mixing conductive particles having at least two different particle size distribution; and a binder mainly made of thermosetting resin. COPYRIGHT: (C)2004,JPO&NCIPI