发明名称 PLASMA GENERATING DEVICE AND PLASMA ETCHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma generation device capable of executing a suitable etching process regardless of the thickness of a workpiece, and suitably usable for the etching process for various workpieces. <P>SOLUTION: This plasma generation device is so structured that a cathode electrode 62 and an anode electrode 64 are disposed on one side facing to a processing surface of the workpiece 16, and plasma is generated between the cathode electrode 62 and the anode electrode 64 so as to etch the workpiece. The cathode electrode 62 is disposed by directing its end face to the processing surface of the workpiece 16; the anode electrode 64 is disposed by interposing an electrical insulation material 66 disposed along the outer edge of the cathode electrode 62 and by directing its end face to the processing surface of the workpiece; and a high-frequency power supply 68 for applying a high-frequency voltage between the cathode electrode 62 and the anode electrode 66 is installed. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004265627(A) 申请公布日期 2004.09.24
申请号 JP20030036327 申请日期 2003.02.14
申请人 TOSHIMA MASATO 发明人 TOSHIMA MASATO
分类号 H05H1/46;G02F1/13;H01J37/32;H01L21/3065;H05H1/24 主分类号 H05H1/46
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