FORMING METHOD OF SHEET INCLUDING INTERNAL CIRCUIT AND INTERLAYER CONNECTION MATERIAL USED WHEN ELECTRONIC COMPONENT IS MANUFACTURED

摘要

PROBLEM TO BE SOLVED: To provide a sheet for constituting an electronic component which can contribute to high integration, miniaturization and high reliability of the electronic component, regarding the stacked electronic component.

SOLUTION: The sheet which is used as each layer of the electronic component when the stacked electronic component is formed has constitution which includes an internal circuit electrode and an interlayer connection post inside.

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