发明名称 COOLING STRUCTURE OF INDUCTION HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure of an induction heating device having a coil of which, cooling property is improved by removing a dead air region generated around the coil or the like, cooled to a prescribed allowable temperature or less. SOLUTION: On the induction heating device comprising a coil 3 wound in a disc-shape, an electronic device 4 generating high frequency electric power, a fan 7 cooling the coil 3 or the like, a case 1 composed of a coil case 1a storing the coil 3 and an electronic component case 1b storing the electronic device 4 and the fan 7, and a ceiling plate 2 covering the surface of the case 1, heating by an eddy current generated on a magnetic material placed on the upper surface of the ceiling plate 2 by means of the high frequency electric current flowing through the coil 3, the coil part 3 is cooled by coupling an air guide plate 14 guiding the cooling air to the coil 3 by partially blocking the flow of the cooling air sent from the fan 7 to the coil case 1a, and by guiding the cooling air to the coil part 3. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004265871(A) 申请公布日期 2004.09.24
申请号 JP20040114021 申请日期 2004.04.08
申请人 HITACHI HOMETEC LTD 发明人 OKADA YUKO;TANAKA TAKEO;MORI HIDEAKI;SHOJI TETSUYA;OTOMO HIROSHI
分类号 H05B6/12;H05K7/20;(IPC1-7):H05B6/12 主分类号 H05B6/12
代理机构 代理人
主权项
地址