| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device where high reliability is obtained in an operation on grinding of the rear face of a thinned semiconductor wafer, dicing and making of individual chips; and to provide a protection tape and a semiconductor device. SOLUTION: Processing step 11 is a grinding process of the rear face of the semiconductor wafer. Namely, the grinding protection tape is stuck to a main surface side of the semiconductor wafer where an integrated circuit is formed. A rear face side is ground by a prescribed thickness. Then, the system is shifted to the dicing process which is processing step 12. The semiconductor wafer is cut into respective pieces (respective chips) from the rear face while the grinding protection tape is stuck as it is. The grinding protection tape remains as one tape as it is without being completely separated. COPYRIGHT: (C)2004,JPO&NCIPI |
