发明名称 |
MOLD RELEASE SHEET FOR PRODUCING SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE USING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mold release sheet for producing a substrate used in a method for producing the substrate having high reliability and excellent productivity. <P>SOLUTION: Optional parts of a prepreg 1 and a copper foil 3a are hot-pressed through the mold release sheets 5 for producing the substrate with heater punches 4a and 4b to thereby soften a resin contained in the prepreg 1 and carry out adhesion. Only the heater punches 4a and 4b are then opened once. After the temperature of the prepreg 1 becomes a temperature not higher than the softening point of the resin contained in the prepreg, the mold release sheets 5 for producing the substrate are successively released from the one side and a copper foil 3b is further laminated to hot-press the optional parts again with the heater punches 4a and 4b. The whole surface is then hot-pressed with a hot press. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
申请公布号 |
JP2004262951(A) |
申请公布日期 |
2004.09.24 |
申请号 |
JP20030009447 |
申请日期 |
2003.01.17 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KISHIMOTO KUNIO;TAKENAKA TOSHIAKI;HIRAISHI YUKIHIRO |
分类号 |
C08J5/18;B32B27/00;C08J5/24;H05K3/46;(IPC1-7):C08J5/24 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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