发明名称 COMPOSITE WIRING BOARD AND SUBSTRATE ELEMENT PIECE
摘要 PROBLEM TO BE SOLVED: To provide an easily handleable and inexpensive composite wiring board. SOLUTION: After first and second substrate element pieces 2A and 2B are formed by laminating single-layered or laminated rigid wiring boards 20 and 30 and flexible wiring boards 10 upon another so that joints 42 composed of one end sections of the flexible wiring boards 10 may be protruded from one side faces of the pieces 2A and 2B, this composite wiring board is constituted by connecting the joints 42 of the pieces 2A and 2B to each other. Since the first and second substrate element pieces 2A and 2B can be handled individually until the joints 42 are connected to each other, the workability is improved. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266238(A) 申请公布日期 2004.09.24
申请号 JP20030115489 申请日期 2003.04.21
申请人 SONY CHEM CORP 发明人 MURAYAMA TAKASHI
分类号 H05K1/02;H05K1/14;H05K3/00;H05K3/36;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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