发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which a threshold can satisfactorily be adjusted when a material in a silicon mid gap is adopted for the gate electrode. SOLUTION: The semiconductor device is formed on an SOI substrate 4 having a support substrate 1, an insulating film 2 formed on the support substrate 1, and a single crystal Si layer 3 formed on the insulating film. The device is provided with epitaxial layers 5 formed on the single crystal Si layer and are composed of Si<SB>x</SB>Ge<SB>1-x</SB>, gate insulating films 6 formed on the epitaxial layers 5, gate electrodes 11a and 11b which are formed on the gate insulating films 6 and have metal layers or conductive metal compound layers, and diffusion layers 16 to 19 of source/drain regions which are formed below both sides of the gate electrodes and formed in the epitaxial layers. Channel regions are formed in the epitaxial layers below the gate electrodes. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266064(A) 申请公布日期 2004.09.24
申请号 JP20030053999 申请日期 2003.02.28
申请人 SEIKO EPSON CORP 发明人 SHIMADA HIROYUKI
分类号 H01L21/28;H01L29/423;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/28
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