发明名称 CONDUCTIVE FINE PARTICULATE AND CONDUCTIVE CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive fine particulate which can alleviate stress generated in an electric circuit and have high thermal conductivity, and provide a conductive connection structure. SOLUTION: In these conductive particulates, the surface of porous base material particulates made of resin is covered by a metal layer, and the conductive connection structure is constructed by using the conductive particulates. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004265711(A) 申请公布日期 2004.09.24
申请号 JP20030054233 申请日期 2003.02.28
申请人 SEKISUI CHEM CO LTD 发明人 NAGAI YASUHIKO
分类号 H01B5/00;H01B5/14;(IPC1-7):H01B5/00 主分类号 H01B5/00
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