| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a fine pattern printed circuit, which has adequate adhesive strength to a resin substrate, solves problems such as remaining copper and narrowing of a wiring line occurring when forming a fine pattern, and has superior heat resistance and electric characteristics; and to provide a manufacturing method therefor. SOLUTION: The copper foil for the fine pattern printed circuit has a roughened surface on the untreated copper foil, wherein the untreated copper foil before being roughened has a surface roughness of 2.5μm or less by 10 points average roughness Rz, and a distance between the lowest peaks of undulation on a base material in a length of 5μm or more. The untreated copper foil to be roughened similarly to the above, is preferably an electrolytic copper foil having crystal grains with an average particle diameter of 2μm or less appear on the surface. COPYRIGHT: (C)2004,JPO&NCIPI
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