PHOTORESIST COATING APPARATUS TO REMOVE RESIDUAL PHOTORESIST FROM FLAT ZONE

摘要

PURPOSE: A photoresist coating apparatus is provided to remove a residual photoresist from a flat zone by wrapping a wafer and injecting a cleaning solution to the wafer. CONSTITUTION: A wafer is loaded on a spin chuck(100). The spin chuck is moved vertically to a top part or a bottom part. An injection nozzle is used for injecting a photoresist on a surface of the wafer. A cleaning unit removes the residual photoresist from an edge of the wafer. The cleaning unit includes a storage member for wrapping the wafer, an injection part(220) installed within the storage member to inject the cleaning solution to the edge of the wafer, and a draining part(230) for draining the cleaning solution.