| 摘要 |
PROBLEM TO BE SOLVED: To provide a rotating shaft sealing mechanism having improved the sealing performance around the rotating shaft and a liquid processing apparatus provided with this rotating shaft sealing mechanism. SOLUTION: The cleaning process apparatus comprises a rotor 34 for holding a wafer W, an external chamber 71a and an internal chamber 71b which can accommodate the rotor 34, a spindle 50 for rotating the rotor 34, and a bearing member 11 and a cylindrical member 12 provided around the spindle 50. At the internal circumference surface of the cylindrical member 12, sealing members 13a to 13c are provided and a resin film 15 is formed over the sealing members 13a to 13c to the internal circumference surface of the cylindrical member 12. A clearance between the resin film 15 and the spindle 50 at the area where the sealing members 13a to 13c are provided is adjusted by frictional wear of the resin film 15 by rotating the spindle 50 for the predetermined period after the spindle 50 is inserted or placed with pressure into the cylindrical member 12. COPYRIGHT: (C)2004,JPO&NCIPI
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