MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic electronic component capable of suppressing a structural defect caused by exfoliation of a ceramic sheet. SOLUTION: The ceramic sheet 13 with a conductor layer 14 is formed on a carrier film 15. Then the ceramic sheet 13 with the conductor layer 14 is stacked on other ceramic sheet 13 of a support plate 11 together with the carrier film 15, and the upper side is entirely pressed. Then corners of the ceramic sheet 13 acting like separating points between the carrier film 15 and the ceramic sheet 13 are pressed and heated again by a press machine 17 via the carrier film 15, and thereafter the carrier film 15 is exfoliated. Similarly, the ceramic sheets 13 with the conductor layer 14 are stacked to produce a laminated body block 19. Then the block 19 is cut and sintered to form an external electrode. COPYRIGHT: (C)2004,JPO&NCIPI