CUTTING METHOD USING SLICER AND EQUIPMENT THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a cutting method using a slicer for cutting a wafer having a main surface of a specific crystal face azimuth from a single crystal ingot while preventing the waste of the wafer due to test cutting. SOLUTION: In this cutting method for cutting the single crystal ingot in parallel to a specific crystal face by the slicer, a first ingot is placed on a stage to be subjected to first cutting by the slicer and a plane detecting sensor is applied to the first cut surface of the first ingot to specify the first cut plane of the first ingot. A second ingot is placed on the stage in place of the first ingot and the plane detecting sensor is applied to the end surface of the second ingot to adjust the stage so as to make the end surface of the second ingot parallel to the first cut plane. The stage is readjusted on the basis of the known geometric relation between the end surface of the second ingot and the specific crystal face azimuth in the second ingot to be set so as to make the specific crystal face azimuth parallel to the first cut plane before subjecting the second ingot to second cutting by the slicer. COPYRIGHT: (C)2004,JPO&NCIPI