| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor element is connected suitably with a corresponding conduction channel on a wiring board, and to provide a radiation detector employing it. <P>SOLUTION: A glass substrate provided with a through hole 20c having such a tapered part 20d as the opening area increases on the input surface 20a side, and a wiring board 20 comprising a conductive member 21 formed on the inner wall of the through hole 20c are employed. For the input part 21a of the conductive member 21 formed on the input surface 20a of the wiring board 20, a bump electrode 17 provided on the output surface 15b of a PD array 15 in correspondence with the conductive member 21 is connected to obtain a semiconductor device 5. A scintillator 10 is connected with the light incident surface 15a of the PD array 15 through an optical adhesive 11, and a signal processing element 30 is connected with the output surface 20b of the wiring board 20 through a bump electrode 31 thus constituting a semiconductor detector. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
