| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet that is adhered to a wafer by one step and wherein an adhesive agent can be cut at the same time, dicing efficiency is high and half cutting method can be used. SOLUTION: The adhesive sheet 10 is provided with an adhesive agent layer 2 wherein an adhesive agent is applied onto a substrate film 1 with adhesive property, and the adhesive agent layer 2 is provided with grooves 11 at specified positions that penetrate the adhesive agent layer having a shape of semiconductor element. COPYRIGHT: (C)2004,JPO&NCIPI |
