| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer wiring board having low electrical resistance in a multilayer connection electric circuit, and superior in the electrical characteristics. SOLUTION: An interlayer conductive viahole 18 is formed by the combined body of metal powder, and a projecting part 18A which projects to the outside of the multilayered adhesive face of an ahdesive layer 13 is made of by the combined body of the metal powder. COPYRIGHT: (C)2004,JPO&NCIPI |
