发明名称 DEVICE FOR COOLING INJECTION MOLD WITH HEAT PIPE INSTALLED AT MOLD
摘要 PURPOSE: A device for cooling an injection mold is provided to improve cooling efficiency by installing a heat pipe at the mold and mounting a plurality of heat radiating pins to one side of the heat pipe. CONSTITUTION: A device for cooling an injection mold is composed of a mold(10), a heat pipe(20) inserted into the mold and filled with actuating fluid, and a plurality of heat radiating pins(30). The heat radiating pins are installed at one side of the heat pipe, and radiate heat.
申请公布号 KR20040082088(A) 申请公布日期 2004.09.24
申请号 KR20030016716 申请日期 2003.03.18
申请人 APACK, INC. 发明人 HAN, JAE SEOP;KIM, GWANG SU;SONG, GYU SEOP
分类号 B29C45/73;(IPC1-7):B29C45/73 主分类号 B29C45/73
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