发明名称 |
DEVICE FOR COOLING INJECTION MOLD WITH HEAT PIPE INSTALLED AT MOLD |
摘要 |
PURPOSE: A device for cooling an injection mold is provided to improve cooling efficiency by installing a heat pipe at the mold and mounting a plurality of heat radiating pins to one side of the heat pipe. CONSTITUTION: A device for cooling an injection mold is composed of a mold(10), a heat pipe(20) inserted into the mold and filled with actuating fluid, and a plurality of heat radiating pins(30). The heat radiating pins are installed at one side of the heat pipe, and radiate heat.
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申请公布号 |
KR20040082088(A) |
申请公布日期 |
2004.09.24 |
申请号 |
KR20030016716 |
申请日期 |
2003.03.18 |
申请人 |
APACK, INC. |
发明人 |
HAN, JAE SEOP;KIM, GWANG SU;SONG, GYU SEOP |
分类号 |
B29C45/73;(IPC1-7):B29C45/73 |
主分类号 |
B29C45/73 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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