| 摘要 |
PROBLEM TO BE SOLVED: To prevent a compound semiconductor wafer from being contaminated by outgassing from a container when the wafer is accommodated in a synthetic resin-made container and stored or delivered, and to prevent generation of faults in quality when epitaxial growth is performed to the wafer. SOLUTION: In the cleaning method of a synthetic resin-made container which is used for storing or delivering a compound semiconductor wafer subjected to mirror polishing, the container is heated for a constant period of time at a prescribed temperature (desirably at least 80°C) in a vacuum atmosphere before the wafer is accommodated. By flashing and eliminating volatile component, cleaning is performed. COPYRIGHT: (C)2004,JPO&NCIPI |
