发明名称 MANUFACTURING METHOD OF CONDUCTIVE PASTE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of conductive paste for stably forming a high quality via-hole conductor with less variations and realizing a circuit board having high connection reliability. <P>SOLUTION: The conductive paste is manufactured by the method comprising a step of preparing conductive particles; a step of measuring the coagulation degree of the particles; a step of applying decomposition of the particles in response to the measured result of the coagulation degree; and a step of adding a binder and kneading. The circuit board is manufactured by using the conductive paste. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004265608(A) 申请公布日期 2004.09.24
申请号 JP20030014555 申请日期 2003.01.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUGITA YUICHIRO;TAKENAKA TOSHIAKI
分类号 H05K1/09;H01B13/00;H05K3/46;(IPC1-7):H01B13/00 主分类号 H05K1/09
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