发明名称 |
MANUFACTURING METHOD OF CONDUCTIVE PASTE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of conductive paste for stably forming a high quality via-hole conductor with less variations and realizing a circuit board having high connection reliability. <P>SOLUTION: The conductive paste is manufactured by the method comprising a step of preparing conductive particles; a step of measuring the coagulation degree of the particles; a step of applying decomposition of the particles in response to the measured result of the coagulation degree; and a step of adding a binder and kneading. The circuit board is manufactured by using the conductive paste. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
申请公布号 |
JP2004265608(A) |
申请公布日期 |
2004.09.24 |
申请号 |
JP20030014555 |
申请日期 |
2003.01.23 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUGITA YUICHIRO;TAKENAKA TOSHIAKI |
分类号 |
H05K1/09;H01B13/00;H05K3/46;(IPC1-7):H01B13/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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