发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To protect the gate insulating film from charging up at the time of forming a gate contact. SOLUTION: When the gate contact 6a on a polycrystalline silicon gate 4a is formed, charges accumulated on an interlayer insulating film 6 are set free onto the semiconductor substrate 1 through a polycrystalline silicon layer 4b at a periphery of the polycrystalline silicon gate 4a. Thus, flow-in of the charges accumulated on the interlayer insulating film 6 to the polycrystalline silicon gate 4a is reduced. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266067(A) 申请公布日期 2004.09.24
申请号 JP20030054009 申请日期 2003.02.28
申请人 SEIKO EPSON CORP 发明人 SAWADA JUN
分类号 H01L21/28;H01L21/336;H01L21/768;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/28
代理机构 代理人
主权项
地址