| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent the occurrence of scratches by controlling the minimum dimension of a dummy pattern and, at the same time, can be manufactured efficiently by shortening polishing time, and to provide a method of manufacturing the device. SOLUTION: A process of forming an element separating area on a substrate includes a step of forming a mask by applying a resist to the substrate, a step of forming grooves in an actual element area and a dummy pattern area, respectively, by using the mask, and a step of causing insulating films to deposit in the grooves. The process also includes a step of forming the element separating area on the substrate by removing the insulating films protruded from the insides of the grooves. The width of the dummy pattern in the dummy pattern area is made smaller than the quadruple of the depth of the groove formed in the dummy pattern area. COPYRIGHT: (C)2004,JPO&NCIPI
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