| 摘要 |
PROBLEM TO BE SOLVED: To provide a nitride aluminum metallized substrate capable of manufacturing a small high density circuit board with high yield by preventing the solder from flowing to a wire bonding area on the surface of a metallized layer with the solder-flow preventing part superior to heat resistance. SOLUTION: The nitride aluminum metallized substrate on which a wiring circuit is composed of by forming a metalized layer 2a on the surface of the nitride aluminum substrate 1a has a resist pattern 3a for preventing a solder flow formed on the surface of the metallized layer. COPYRIGHT: (C)2004,JPO&NCIPI
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