发明名称 MAGNETIC TUNNEL JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a magnetic tunnel junction structure which is improved to be adaptable to a high-performance magnetic RAM element, and a magnetic tunnel junction structure manufactured with the same. SOLUTION: The magnetic tunnel junction structure and the method of manufacturing the same are provided. The magnetic tunnel junction structure has a lower electrode. The lower electrode is formed of a platinum layer, a ruthenium layer, an iridium layer, a rhodium layer, an osmium layer, a palladium layer, or a layer of oxides of these, and shows smooth surface morphology. Such a smooth surface morphology improves hysteresis loop characteristics of the magnetic tunnel junction structure. In addition, since the lower electrode also serves the role of a conventional seed layer, the manufacturing process is simplified. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266252(A) 申请公布日期 2004.09.24
申请号 JP20030406447 申请日期 2003.12.04
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE KYU-MANN;KIM TAE-WAN;SONG I-HUN;KIM HYUN-JO;PARK JEONG-HEE;CHUNG SEOK-JAE
分类号 H01L27/105;G11C11/14;G11C11/15;H01L21/8234;H01L21/8244;H01L21/8246;H01L27/22;H01L43/08;H01L43/10;H01L43/12;(IPC1-7):H01L27/105 主分类号 H01L27/105
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