METHOD OF PLATING BACK SURFACE OF WAFER FOR INCREASING PRODUCTIVITY BY PROCESSING CLEARLY DICING FACE THEREOF

摘要

PURPOSE: A method of plating a back surface of a wafer is provided to process clearly a dicing face of the wafer by performing a partial plating process on the remaining part except for a cut part of the wafer. CONSTITUTION: A thin metal layer(13) is formed on a back surface of a wafer(11). A photoresist layer pattern is formed on the thin metal layer. A plating process for the back surface of the wafer is performed. The photoresist layer is removed therefrom and the thin metal layer is removed by an etching process. An adhesive tape(16) is adhered on the gold(15) plated on the back surface of the wafer. The wafer is cut along a dicing face. The photoresist layer pattern is formed only on a wafer dicing part.