| 摘要 |
PURPOSE: A non thermal plasma plating method is provided which is capable of contributing to adhesion improvement of plating layer by treating plasma, particularly non thermal plasma onto the surface of a plating substrate in the plating pretreatment process. CONSTITUTION: In a plating method comprising a pretreatment process of cleaning, purifying and activating the surface of a plating substrate; and a plating layer forming process of forming a plating layer on the surface of the plating substrate passing through the pretreatment process, the plating method is characterized in that non thermal plasma treatment is performed on the surface of the plating substrate in the pretreatment process, wherein at least one plasma selected from the group consisting of helium plasma, argon plasma, oxygen plasma and hydrogen plasma is used in the non thermal plasma treatment, wherein the non thermal plasma treatment is carried out in the atmosphere, and wherein the pretreatment process is a pretreatment process for electroless plating including etching step, neutralization step, catalyzing step and activation step sequentially performed, and the non thermal plasma treatment is performed between the neutralization step and the catalyzing step.
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