ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF TO PREVENT IMPERFECT BONDING OR CRACK

摘要

PURPOSE: An electronic component is provided to prevent imperfect bonding or crack by substantially equalizing transfer efficiency of supersonic waves and by embodying a substantially equal bonding state in every interconnection. CONSTITUTION: A plurality of interconnections(11,12) are formed in different direction on a substrate(10A). By using supersonic vibration, a plurality of electrodes of an electronic component are bonded to the plurality of interconnections at a time through a bump. A displacement control layer(13) having higher intensity than that of a substrate material is formed in the substrate under an interconnection having a large angle with the direction of supersonic vibration.