发明名称 |
Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |
摘要 |
The method for selective deposition of Co-W-P system films onto copper with palladium-free activation consists of creating hydrogen-rich complexes on the metal surface prior to deposition. More specifically, the method consists of creating the aforementioned complexes on the copper surfaces prior to electroless deposition of a Co-W-P system films. This is achieved by contacting the copper surface with reducing agents for a short period of time and under an elevated temperature. Such reducing agents comprise a hypophosphorous-acid-based or borane-based reducing agents such as dimethylamine borane. Hypophosphorous acid is preferred since it is more compatible with the electroless deposition solution.
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申请公布号 |
US6794288(B1) |
申请公布日期 |
2004.09.21 |
申请号 |
US20030345134 |
申请日期 |
2003.05.05 |
申请人 |
BLUE29 CORPORATION |
发明人 |
KOLICS ARTUR;PETROV NICOLAI;TING CHIU;IVANOV IGOR C. |
分类号 |
C23C18/16;C23C18/18;C23C18/34;C23C18/50;H01L21/288;H01L21/44;H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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