发明名称 |
Method of fabricating a semiconductor device and an apparatus embodying the method |
摘要 |
A method for fabricating an apparatus, and an apparatus embodying the same is disclosed. First a device chip having circuit elements is fabricated. Next, a cap with a cap circuit is fabricated. Finally, the cap is placed on the device chip to connect a first contact point with a second contact point using the connector on the cap. The apparatus includes a device chip and a cap. The device chip has the first contact point and a second contact point. The cap has the cap circuit that, when the cap is placed on the device chip, connects the first contact point with the second contact point.
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申请公布号 |
US6794958(B2) |
申请公布日期 |
2004.09.21 |
申请号 |
US20020202974 |
申请日期 |
2002.07.25 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
PHILLIBER JOEL ALAN;RUBY RICHARD C. |
分类号 |
H03H9/10;(IPC1-7):H03H9/54;H03H9/60;H03H9/02;H01L23/06;H01L23/10 |
主分类号 |
H03H9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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