发明名称 Method of making a power semiconductor device
摘要 A method is provided for forming a power semiconductor device. The method begins by providing a substrate of a first or second conductivity type and then forming a voltage sustaining region on the substrate. The voltage sustaining region is formed by depositing an epitaxial layer of a first conductivity type on the substrate and forming at least one trench in the epitaxial layer. A first layer of polysilicon having a second dopant of the second conductivity type is deposited in the trench. The second dopant is diffused to form a doped epitaxial region adjacent to the trench and in the epitaxial layer. A second layer of polysilicon having a first dopant of the first conductivity type is subsequently deposited in the trench. The first and second dopants respectively located in the second and first layers of polysilicon are interdiffused to achieve electrical compensation in the first and second layers of polysilicon. Finally, at least one region of the second conductivity type is formed over the voltage sustaining region to define a junction therebetween.
申请公布号 US6794251(B2) 申请公布日期 2004.09.21
申请号 US20030414949 申请日期 2003.04.16
申请人 GENERAL SEMICONDUCTOR, INC. 发明人 BLANCHARD RICHARD A.
分类号 H01L21/331;H01L21/22;H01L21/225;H01L21/329;H01L21/336;H01L29/06;H01L29/10;H01L29/732;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/331
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