PHOTOSENSITIVE RESIN COMPOSITION FOR PREVENTING OXIDATION OF COPPER, WHICH COMPRISES ALKALI-DEVELOPING BINDER POLYMER, PHOTOPOLYMERIZABLE OLIGOMER, PHOTOPOLYMERIZATION INITIATOR AND ADDITIVES

摘要

PURPOSE: A photosensitive resin composition is provided, to prevent the oxidation of copper and to improve the adhesive strength of copper with improving the adhesive strength of fine line. CONSTITUTION: The photosensitive resin composition comprises an alkali-developing binder polymer; a photopolymerizable oligomer; a photopolymerization initiator; and an additive which comprises a benzotriazole derivative represented by the formula 1 or 2 for preventing the oxidation of copper and for improving the adhesive strength of copper. Preferably the content of the benzotriazole derivative is 0.01-5.0 wt%.