INJECTION MOLD APPARATUS FOR SEMICONDUCTOR WIRE BONDING COMPONENTS TO IMPROVE QUALITY AND PRODUCTIVITY

摘要

PURPOSE: An injection mold apparatus for semiconductor wire bonding components is provided to improve quality and productivity by forming uniform density of particles of raw materials in a process for forming a capillary. CONSTITUTION: An upper mold is coupled to one side of an injection mold apparatus and includes a gate for injecting raw materials. A lower mold is coupled to the other side of the injection mold apparatus corresponding to the upper mold and includes a lower plate and an eject device for removing injection materials. A plurality of core members(160) includes hole formation pins for forming capillary holes. An eject pins(260) is coupled between an upper plate and a lower plate of the eject device. A guide hole(262) is formed to the longitudinal direction of the eject pin. A control rod(270) is inserted into the guide hole. A stopper is formed at a rear end of the control rod. An elastic member(280) is formed at a rear part of the control rod.