| 摘要 |
PURPOSE: An apparatus for bonding DAF(die attach film) tape is provided to attach the DAF tape to a wafer without forming a wrinkle on the DAF tape and/or air bubbles under the DAF tape. CONSTITUTION: A wafer(41) is fixed on a table. DAF tape(12) is disposed on the wafer. A ring-shaped holder holds both side surfaces of the DAF tape to fix the DAF tape. A gas supply unit(50) supplies gas toward the DAF tape in the ring-shaped holder. The gas is discharged to the DAF tape to make the DAF tape in the holder expand toward the wafer, thereby attaching the DAF tape to the wafer.
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