| 摘要 |
FIELD: electronics, namely soldering different type materials, mainly metals with silicon, with quartz glass, ceramics. ^ SUBSTANCE: method comprises steps of using for soldering composition type solder containing solid-phase porous ferromagnetic matrix and easy-to-melt diamagnetic component; placing assembly prepared for soldering in magnetic field according to condition of increased capillary force acting upon easy-to-melt component due to creation of magnetic effort pulling it out of ferromagnetic matrix; performing soldering at temperature lower than that of magnetic conversion of solid-phase matrix. ^ EFFECT: possibility for receiving strength joints with predetermined thickness, physical and mechanical properties. ^ 2 ex
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