| 摘要 |
PURPOSE: A semiconductor device is provided to perform a miniaturization and a high-density mounting by, when a micro computer chip with a number of terminals and a memory chip with a relatively small number of terminals are stacked on an interconnection substrate, disposing the micro computer chip in the lower layer and the memory chip in the upper layer. CONSTITUTION: An interconnection substrate(1) has the first surface and the second surface confronting the first surface. The first pad is formed in the first region of the first surface and the second pad is formed in the second region surrounding the first region. A bump electrode(BC) is formed on the surface of a micro computer chip(2C). The third pad is formed on the surface of a memory chip(2A,2B) mounted on the back surface of the micro computer chip. The third pad is connected to the second pad by a conductive wire(10). |
