发明名称 |
METHOD FOR FORMING OXIDE FILM HAVING HIGH DIELECTRIC CONSTANT, CAPACITOR COMPRISING DIELECTRIC FILM FORMED BY THE METHOD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: A method for forming an oxide film having high dielectric constant, a capacitor comprising dielectric film formed by the method and a method for manufacturing the same are provided to reduce the number of ALD apparatuses by using chemical reaction between precursors of aluminum and hafnium. CONSTITUTION: A semiconductor substrate(40) is loaded into an ALD apparatus. A reactant is deposited on an upper surface of the semiconductor substrate. The reactant includes the first reacting element and the second reacting element. The first high dielectric oxide layer(50a) including the first and the second reacting elements is formed on the upper surface of the semiconductor substrate by oxidizing the first and the second reacting elements.
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申请公布号 |
KR20040080291(A) |
申请公布日期 |
2004.09.18 |
申请号 |
KR20030015197 |
申请日期 |
2003.03.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO, YEONG JIN;LEE, JEONG HYEON;MIN, YO SEP;SEO, BEOM SEOK |
分类号 |
H01L21/316;C23C16/40;C23C16/455;H01L21/31;H01L21/314;H01L21/8242;H01L27/108;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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