WIRE BONDING METHOD TO FORM NANO-SCALE BONDING BY USING SCANNING PROBE MICROSCOPE

摘要

PURPOSE: A wire bonding method is provided to overcome the limit of image resolution and to form nano-scale bonding by using SMP(Scanning Probe Microscope). CONSTITUTION: A position for wire bonding is selected by using an optical microscope(S301). Surface roughness information of the selected position is determined by using an SMP(Scanning Probe Microscope)(S302). A wire bonding point is selected according to the surface roughness information(S303). Then, wire bonding is performed at the selected point(S304).