SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF TO IMPROVE HEAT RADIATION

摘要

PURPOSE: A semiconductor device is provided to improve heat radiation by using conductive adhesive with good heat radiation and heat conductivity while preventing a molding defect of a resin package even if a thin plate-type insulation layer is used. CONSTITUTION: A power semiconductor device(1) is prepared. A metal block(5) is bonded to the power semiconductor device through conductive adhesive. A plate-type insulation layer(7) has the first and second main surfaces that confront each other wherein the first main surface is bonded to the entire region of the bottom surface of the metal block. The power semiconductor device and the metal block are covered with a resin package wherein the second main surface is exposed.