发明名称 A CIRCUIT BOARD AND ARRANGEMENT FOR MINIMIZING THERMAL AND ELECTROMAGNETIC EFFECTS
摘要 <p>The present invention relates to a circuit board of DSLAM and an arrangement to minimize thermal flow or electro-magnetic radiation from digital side to analog side, or vice versa. The circuit board comprises analog components and passive digital components on first side of the circuit board and active digital components on the second side of the circuit board. The arrangement comprises an enclosure having the circuit board with analog components, passive digital components, and active digital components and a first component connected between the first portion and the second portion of the circuit board to restrict thermal flow or electromagnetic radiation from one portion to another portion.</p>
申请公布号 AU2003212394(A1) 申请公布日期 2004.09.17
申请号 AU20030212394 申请日期 2003.02.28
申请人 WIRELESS LAN SYSTEMS OY 发明人 ROBIN CAVEN
分类号 H05K1/02;H05K1/18;H05K7/20;(IPC1-7):H05K3/30 主分类号 H05K1/02
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