SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To inject sealing resin between a semiconductor chip and a film substrate while preventing generation of void.

SOLUTION: In the semiconductor device, a bump electrode 4 has a hexagonal shape and adjacent bump electrodes 4, 4' and 4" are arranged such that the face 4a of the bump electrode 4 constituting a hexagonal prism is opposed to the face 4a" of the bump electrode 4" and the face 4b of the bump electrode 4 is opposed to the face 4b' of the bump electrode 4'. Disturbance of sealing resin flow due to the bump electrodes can be suppressed without changing the injection method of sealing resin and sealing performance of an electronic component can be enhanced while preventing complication of production process.

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