| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting method of a wafer for obtaining a desired cut shape by controlling tilting of a cut surface of the wafer when the wafer is cut by using a scribe method and a stylus dicing method. <P>SOLUTION: A light emitting point 3 of an array chip 9 is disposed in the surface of a GaAs wafer 1, wherein an easy-to-cleave (0-11) surface 5 tilts 3 to 10° to a surface which is vertical to a wafer surface, so that a line connecting the center of the light emitting point 3 is parallel to a sub-orientation flat (IF). The laser beam 6 is cast along a nearby cutting predetermined line 4 near an opposite of the sub-orientation flat (IF) of the light emitting point 3 and a deformed layer 7 which is a trigger of fracture is formed inside the GaAs wafer 1 by laser beam 6. When tensile stress which causes fracture is applied vertically to a cutting line and parallel to the wafer surface, a fracture surface 8 grows along the (0-11) surface 5 and an array chip 9 with a cutting line tilting 3 to 10° can be obtained. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
