| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for sticking a wafer, having enough adhesion to prevent separation between an adhesive layer, a bonding agent layer and the wafer at a dicing process, easily peeling a tip with a bonding agent from the adhesive layer at a pickup process through curing with radioactive rays, and exhibiting sufficient adhesiveness between the tip and a substrate etc., enabling so-called direct die-bonding at a mounting process. SOLUTION: The adhesive tape for sticking the wafer is obtained by forming the radioactive ray-curable adhesive layer and the bonding agent layer for die-bonding, onto the surface of a base material in this order. Wherein the adhesive layer is composed mainly of an acrylic copolymer having principal chains each bonding at least a radioactive ray-curable carbon-carbon double bond-having group and a hydroxy group and carboxy group-having group, and has≥60% gel fraction. COPYRIGHT: (C)2004,JPO&NCIPI |
