| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when the rotating speed of a spin chuck 3 or the discharge pressure of a cleaning solution 6 is increased in a spin cleaner for a single wafer 101, a mist tends to fly high and again contaminates the surface of a semiconductor substrate 2. SOLUTION: This wafer spin cleaner 101 comprises the spin chuck 3, a rotary shaft 5 connected to a motor 4, and a discharge nozzle 7. This cleaner 101 also comprises an ultrasonic vibrator 8, a nozzle driving section 9, and a pressure pump 10. Moreover, this cleaner 101 also comprises a reservoir 11, a chamber 12, and drain ports 13a and 13b. In addition, this cleaner 101 also comprises first and second exhaust systems 14 and 102, an exhaust pressure control unit 103, and a Pitot tube current meter 104. In this spin cleaner 101, first exhaust ports 16a and 16b are provided at positions lower than the surface of the semiconductor substrate 2, and second exhaust ports 105a and 105b are provided at positions higher than the surface of the substrate 2. COPYRIGHT: (C)2004,JPO&NCIPI |
