发明名称 |
ELECTRONIC CIRCUIT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device having a power supply structure that can cope with high-speed signals exceeding the GHz band. SOLUTION: A driver transistor 10 is formed on the surface of a semiconductor substrate 1. A power supply ground-pair transmission line 20 which supplies electric power to the driver transistor 10, and a signal ground-pair transmission line 30 which transmits signals to a receiver, are also formed on the semiconductor substrate. The power supply ground-pair transmission line 20 is connected to the drain layer 3 of the driver transistor 10 and a P<SP>+</SP>-type layer 7 in a P-type well 2. In addition, the signal ground-pair transmission line 30 is connected to the source layer 4 of the transistor 10 and a P<SP>+</SP>-type layer 8 in the P-type well 2. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004259722(A) |
申请公布日期 |
2004.09.16 |
申请号 |
JP20030045422 |
申请日期 |
2003.02.24 |
申请人 |
OTSUKA KANJI;USAMI TAMOTSU;SANYO ELECTRIC CO LTD;OKI ELECTRIC IND CO LTD;SHARP CORP;SONY CORP;TOSHIBA CORP;NEC CORP;HITACHI LTD;MATSUSHITA ELECTRIC IND CO LTD;MITSUBISHI ELECTRIC CORP;FUJITSU LTD;ROHM CO LTD |
发明人 |
OTSUKA KANJI;USAMI TAMOTSU |
分类号 |
H01L21/822;G06F13/40;H01L23/528;H01L23/66;H01L27/04;H01P3/00;H01P3/08;(IPC1-7):H01L21/822 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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