| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing circuit board by which copper foil disposed on and under a dielectric can be connected easily to conductors by using a thermoplastic resin as the dielectric. SOLUTION: The upper copper foil 2 and the lower copper foil 3 are connected to the conductors by pressing a fixture 6 having a projection against a circuit board forming material constituted of the thermoplastic resin 1, the upper copper foil 2, and the lower copper foil 3 and, at the same time, imparting an ultrasonic wave to the fixture 6 while the circuit board forming material is heated. Since the upper and the lower copper foil 2 and 3 can be connected easily to the conductors, an inexpensive circuit board can be mass-produced. At the same time, radio terminals, radio base stations, and radar equipment can be manufactured inexpensively, and at the same time high-frequency circuits for microwaves or milliwave bands can be manufactured easily. COPYRIGHT: (C)2004,JPO&NCIPI
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