SEMICONDUCTOR PRODUCTION SYSTEM, METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To increase the clearance between the end part of a semiconductor chip and the lead terminal of a tape substrate while suppressing the height of a bump electrode. SOLUTION: A bonding stage 16 is arranged such that the end part 16a thereof is located at the position of the end part 35a of a semiconductor chip 35 and the semiconductor chip 35 is mounted on the tape substrate 31 while sucking the tape substrate 31 through a suction groove 17. COPYRIGHT: (C)2004,JPO&NCIPI