| 摘要 |
PROBLEM TO BE SOLVED: To provide plasma process equipment for plasma processing having a means which has high dust elimination efficiency when a large wafer substrate is used and ejects surely once eliminated dust to the outside of the system, and to provide a dust removal method. SOLUTION: The plasma process equipment is provided with a first electrode for generating a plasma and a second electrode for moving dust. The first and the second electrodes are arranged in the direction parallel to the surface of a substrate 11 to be treated. A high frequency voltage and a polyphase AC voltage are applied to a substrate holder 10 for holding the substrate 11. While a plasma treatment is performed, the dust is carried by using a traveling wave electric field which the potential distribution by the polyphase AC voltage forms. The dust is ejected from inside the treatment chamber 7 by using a venting means. COPYRIGHT: (C)2004,JPO&NCIPI
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