| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for thin-layer metrology of semiconductor substrates that performs both a macrometrology (inspection) and a micrometrology (inspection) with only a single apparatus. SOLUTION: The apparatus for thin-layer metrology has at least one cassette element for the semiconductor substrates, a first measurement unit for thin-layer micrometrology, and a transport mechanism provided between the cassette element for the semiconductor substrates and the measurement unit for thin-layer micrometrology. A measurement unit (9) for thin-layer macrometrology is positioned in the region of the transport mechanism (7), after the cassette element (3) and in front of the first measurement unit for thin-layer micrometrology (5). COPYRIGHT: (C)2004,JPO&NCIPI
|
